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部分授权专利(第一发明人): (1) 一种改善Cu基体与碳基薄膜结合力的方法,2022-06-03,ZL 202120700140.X (2) 一种利用非晶碳低温制备石墨烯的方法,2022-11-15,ZL 202010610464.X (3) 金刚石膜高效散热材料及制备办法, 2021-03-23,ZL 201910711380.2 (4) 一种提高金刚石衬底光学透过率的方法, 2022-09-30,CN202211212567.6 5. |